Our soldering process is carried out using controlled thermal joining methods that ensure electrical continuity and mechanical strength. Temperature, dwell time, and solder alloy parameters are optimized according to the conductor and terminal structure.
The process is carefully controlled to minimize the risks of cold solder joints, void formation, and surface contamination. For critical applications, connection reliability is verified through microscopic inspection and pull testing.
Process Category
Electrical Joining Technologies
Standards
IPC-A-610 | IPC/WHMA-A-620 | Customer Specifications
Applications
Defense & Aerospace | Automotive | White Goods
Quality Control
Visual Inspection | Pull Test | Microscopic Inspection
